Browse "ME-Conference Papers(학술회의논문)" by Author Kim, Taek-Soo
Showing results 95 to 134 of 134
| On-Chip Canary Circuit Design for Electronic Interconnects by Utilizing RF Resonance Peak Movement as a Prognostic Factor Kang, Tae Yeob; Seo, Donghwan; Kim, Taek-Soo, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
| Optimization of Cu Interconnects - SiCN Interfacial Adhesion by Surface Treatments Kim, Dong Jun; Kang, Sumin; Lee, Sun Woo; Lee, Inhwa; Park, Seungju; Lee, Jun Soo; Lee, Jihyun; et al, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05 |
| Optimization of Cu interconnects - SiCN interfacial adhesion by surface treatments Kim, Dong Jun; Kang, Sumin; Lee, Sun Woo; Lee, Inhwa; Park, Seungju; Lee, Jihyun; Kim, Joong Jung; et al, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, pp.363 - 373, IEEE, 2023-05-31 |
| Optimization of Multilayer Inorganic/Organic Thin Film Structure for Foldable Barrier Films Shin, Jeong-Ha; Kim, Wansun; Choi, Gwang Mun; Kim, Taek-Soo; Bae, Byeong-Soo, SID 2017, Society for Information Display, 2017-05-24 |
| Optimized CMP for Device Structure Containing Ultra-Low-k Dielectrics Kim, Taek-Soo; R.H. Dauskardt, SEMICON Korea, SEMICON, 2009-01-20 |
| Optimized CMP of Nanomaterials Kim, Taek-Soo; R.H. Dauskardt, 215th Electrochemical Society Meeting, Electrochemical Society, 2009-05-24 |
| Optimizing CMP for Ultra-Low-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, 2008-01-01 |
| Porous Dielectric Elastomer Based Ultra-Sensitive Capacitive Pressure Sensor and Its Application to Wearable Sensing Device Kwon, Donguk; LEE, TAE-IK; Kim, M.S; Kim, S; Kim, Taek-Soo; Park, In-Kyu, 18th International Conference on Solid-State Sensors, Actuators and Microsystems transducers, Transducers, 2015-06-23 |
| Prediction of Wiggling Phenomenon in High Aspect Ratio Thin Film Structure During Etching Process through Buckling-Based Dimensional Analysis Song, Myoung; Jang, Kyung-Lim; Jung, Narae; Kim, Sungjin; Kim, Dae Sin; Kim, Taek-Soo, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Quantitative Roadmap for Optimizing CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, IEEE International Interconnect Technology Conference , IEEE, 2008-06-01 |
| Quantitative Roadmap for Optimizing CMP of Ultralow-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
| Research for Mechanical Reliability Improvement of Silver Nanoparticle Thin Films Lee, I; Kim, Taek-Soo, 2013 KSPE Fall Meeting, KSPE, 2013-10-30 |
| Research on the Adhesion Change of Graphene/Cu Interface by UV/Ozone Treatment Seo, J.; Chang, W.; Kim, Taek-Soo, NANO KOREA 2013 Symposium, NANO KOREA, 2013-07-10 |
| Reversible Self-Bending Soft Hydrogel by using pH Responsive Microbilayer with Mechanically Optimized Designs Kim, Cheolgyu; Kim, Jongmin; Song, YoungShin; Jeong, Seong-Geun; Lee, Chang-Soo; Kim, Taek-Soo, 2018 MRS Spring, Materials Research Society, 2018-04-06 |
| Solar-Rechargeable Wearable Textile Battery Choi, Jang Wook; Lee, Yong-Hee; Kim, Joo-Seong; Noh, Jong-Hyun; Kim, Taek-Soo; Lee, Jung-Yong, 2014 Materials Research Society Spring Meeting, Materials Research Society(MRS), 2014-04-21 |
| Strategies for Improving Mechanical Reliability of Thin Film Flexible Electronics Kim, Taek-Soo, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, The Japan Institute of Electronics Packaging, 2018-04-19 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, SEMICON KOREA 2018, Semiconductor Equipment and Materials International, 2018-02-01 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, IEEE International Flexible Electronics Technology Conference (IFETC), IEEE, 2019-08-13 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, 2019-10-24 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, International Meeting on Information Display, IMID 2021, The Korean Information Display Society (KIDS) & The Society for Information Display (SID), 2020-08-25 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, Advanced Epitaxy for Freestanding Membranes and 2D Materials Conference, AEFM 2023, AEFM, 2023-07-12 |
| Strategies for Mechanically Reliable Thin-Film Flexible Electronics Kim, Taek-Soo, International Conference on Electronics Packaging (ICEP), The Japan Institute of Electronics Packaging, 2023-04-20 |
| Stress Analysis of Rollable OLED Display Considering Boundary Conditions Based on Finite Element Method Ma, Boo Soo; Kim, Taek-Soo, 2018 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12-18 |
| Stress and Solution Chemistry Effects for Optimized CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Zhong, Q; Peterson, M; Tam, H; Konno, T; Dauskardt, R.H., Materials Research Society 2008 Spring Meeting, Materials Research Society, 2008-03-24 |
| Study of Fracture and Tensile Properties of All-Polymer and Fullerene-Polymer Solar Cells Based on Same Polymer Donor Choi, Joonhyeong; Kim, Wansun; Kim, Jae Han; Kim, Taesu; Kim, Mingoo; Kim, Bumjoon J.; Kim, Taek-Soo, APS March Meeting 2018, Bulletin of the American Physical Society, 2018-03-07 |
| Tensile Properties of ALD Alumina without Substrate Measured by Tensile Testing on Water Surface Lee, Sangmin; Koo, Junmo; Kim, Junmo; Shim, Joon-Hyung; Kim, Taek-Soo, 2019 MRS Fall Meeting & Exhibit, Materials Research Society, 2019-12-02 |
| Tensile Testing of Ultra-Thin Films using Water Surface Kim, J; Nizami, A; Hwangbo, Y; Jang, B; Lee, H; Woo, C; Hyun, S; et al, 2013 KSPE Fall Meeting, KSPE, 2013-10-30 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films Lee, I.; Lee, J.; Ko, Seung Hwan; Kim, Taek-Soo, 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging (EMAP), 2013-10-06 |
| Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26 |
| Tuning Depth Profiles of Low-k Dielectrics with UV Curing Kim, Taek-Soo; Tsuji, N; van der Hilst, J; Matsushita, K; Kobayashi, N; Chumakov, D; Geisler, H; et al, Advanced Metallization Conference, Advanced Metallization Conference, 2008-01-01 |
| Tuning UV Curing Depth Profiles for Optimal Mechanical Properties of Low-k Films Kim, Taek-Soo; Chumakov, D; Zschech, E; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
| Ultra-flexible high performance silicon nano-membrane transistor for wearable electronics KIM, SEUNGYOON; Bong, Jae Hoon; Kim, Cheolgyu; Kim, Taek-Soo; Hwang, Wan Sik; Cho, Byung-Jin, The 10th International Conference on Advanced Materials and Devices, Applied Physics Division, The Korean Physical Society, 2017-12-06 |
| Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications Kim, Ji Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-15 |
| Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications Kim, J.-H; LEE, TAE-IK; Shin, J.-W; Kim, Taek-Soo; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28 |
| Visualization and Healing of Graphene Defects Yoon , T.; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-15 |
| Wapage Analysis of Flexible Electronics Kim, Taek-Soo, International Conference on Electronics Packaging, The Japan Institute of Electronics Packaging, 2019-04-19 |
| Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14 |
| Wide Range-Sensitive, Bending-Insensitive Pressure Detection and Application to Wearable Healthcare Device Kim, Seunghwan; Amjadi, Morteza; Lee, Tae-Ik; Jeong, Yongrok; Kwon, Donguk; Kim, Min Seong; Kim, Kyuyoung; et al, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, pp.374 - 377, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
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