DSpace at KOASAS
Browsing DSpace

Browse "ME-Conference Papers(학술회의논문)" by Author Park, JH

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 5 to 8 of 8

5
Novel micro-spiked needles with buried micro-channels for micro-scale biopsy

Byun, S; Lim, JM; Paik, SJ; Lee, A; Koo, KI; Park, S; Park, JH; et al, Asia-Pacific Conf. of Transducers and Micro-Nano Tech., 2004-07

6
Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire

Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09

7
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09

8
Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications

Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008

Discover

rss_1.0 rss_2.0 atom_1.0