Showing results 6 to 9 of 9
Low cycle fatigue analysis temperature dffects in Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints Lee, Soon-Bok; Park, TS, TMA Conference, 2003 |
Measurement of Mechanical Properties of Electroplated Nickel Thin Film for MEMS Application Back, DC; Park, TS; Lee, Soon-Bok; Lee, NK; Choi, TH; Na, KH, KSME 2003 Spring Conference, 2003 |
The Measurement of Mechanical Properties for Nickel Thin Film Park, TS; Baek, DC; Lee, Soon-Bok; Na, KH, Workshop on Development of Micro Optical and Thermofluidic Devices with Functionality, pp.73 - 78, 2002 |
Thermal loading measurement and thermal fatigue test for solder bumps in electronncs packaging Park, TS; Lee, Soon-Bok, KSME 99 Conference of Materials and Fracture Division, KSME 99MF27, pp.55 - 60, 1999 |
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