Browse "ME-Conference Papers(학술회의논문)" by Title
Showing results 5461 to 5480 of 15924
| Haptic interaction with virtual geometry on robotic touch surface Kim, Seung-Chan; Han, Byung-Kil; Seo, Jiwan; Kwon, Dong-Soo, SiggraphAsia 2014, SiggraphAsia 2014, 2014-12-03 |
| Haptic Interface with Hydraulic Actuator for Training Simulation of Radial Artery Puncture LI, CHENGJIE; Lee, Doo Yong, 2018 18th International Conference on Control, Automation and Systems, ICCAS 2018, 2010-10-17 |
| Haptic Interface with Hydraulic Actuator for Training Simulation of Radial Artery Puncture LI, CHENGJIE; Lee, Doo Yong, 2018 18th International Conference on Control, Automation and Systems (ICCAS), pp.24 - 28, ICCAS 2018, 2018-10-17 |
| Haptic Master Device for The Disabled Donverting Contact Force to Tactile Stimulus 이규빈; 권동수, Proceedings of the 14th Korea Automatic Control Conference, pp.354 - 357, 1999 |
| Haptic rendering of drilling into femur bone with graded stiffness Cho, J.H.; Jung, H.; Lee, K.; Lee, Doo Yong; Ahn, H.S., Frontiers in the Convergence of Bioscience and Information Technologies, FBIT 2007, pp.525 - 530, 123, 2007-10-11 |
| Haptic Rendering of Simulation of Radial Artery Puncture LI, CHENGJIE; Min, Heewon; Lee, Doo Yong, The 5th Japan-Korea Joint Symposium on Dynamics & Control, JSME, 2017-08-29 |
| Haptic Simulator for a Spine Biopsy Kwon, Dong-Soo; Kyung, K.U.; Kang, H.S.; Kim, J.K.; Ra, J.B., Proceeding of the Korea Society of Mechanical Engineers 2000 Dynamics & Control Devision Summer Annual Conference, pp.354 - 359, 2000 |
| Haptic Snake - Line-based Physical Mobile Interation in 3D Space Han, Byung-Kil; Kim, Seung-Chan; Kwon, Dong-Soo, AsiaHaptics 2014, AsiaHaptics 2014, 2014-11-18 |
| Haptics for tangible interaction: A vibro-tactile prototype Bianchi A.; Oakley I.; Lee J.K.; Kwon, Dong-Soo; Kostakos V., 5th International Conference on Tangible Embedded and Embodied Interaction, TEI'11, pp.283 - 284, TEI, 2011-01-23 |
| Haptics in a social network service: Tweeting with motion for sharing physical experiences Seung-Chan Kim; Byung-Kil Han; Soo-Chul Lim; Junseok Park; Kwon, Dong-Soo, IEEE World Haptics Conference 2011, ., 2011-06-21 |
| Hardware Implementation of Inverse Kinematics for Robot Manipulators Based on Incremental Unit Computation Method Park, SW; Oh, Jun-Ho, nd Int. Conf. on Automation, Robotics and Computer Vision, pp.15 - 18, 1992-09 |
| Harmonic Fourier Beads 방법을 이용한 최소 자유에너지 경로 계산 이영민; 임세영, 대한기계학회 2007년 추계학술대회, pp.2424 - 2427, 대한기계학회, 2007-11-02 |
| HDD 소음 저감을 위한 음향/진동 분석 김성일; 이정권; 홍어진; 김우성; 이호성; 정철호, KSNVE, pp.421 - 424, 2006-11-16 |
| Healing of wounds by atmospheric pressure plasma Shin, Jennifer Hyunjong, International Society for Plasma Medicine(ISPM), ICPM5, 2014-05-22 |
| Healing Strategies Between Visualized Cell Migration Modes in the Epithelial Wound 정현태; 여진욱; 유승화; 신현정, 2019 한국가시화정보학회 추계학술대회, 한국가시화정보학회, 2019-12-06 |
| Health monitoring method for electronic package using a simple Moire Interferometry Lee, Soon-Bok; Park, Jin-Hyung, ATEM'07 and ACEM6, 2007 |
| Heat and mass flow in arc welding processes and its application to mechanical analysis of welded structure Na, Suck Joo; Cheon, J; Kiran, DV; Cho, DW, 11th International Seminar on Numerical Analysis of Weldability, Institute for Materials Science and Welding (IWS) [Graz University of Technology (TU Graz)], 2015-09 |
| Heat and mass flow in materials welding and its application to mechanical analysis of welded structures Na, Suck Joo, International Symposium – Globalization in Joining Technology and Materials Science: Enhancing Collaboration Network in Greater Asia Region, Joining and Welding Research Institute, Osaka University, 2015-10 |
| Heat and Moisture Recovery Ventilator for Energy Efficiency and Indoor Air Quality Kwon, Jae-Sung; Song, Tae-Ho, 3rd INTERNATIONAL SYMPOSIUM ON ENVIRONMENT, pp.0 - 0, THE ENVIRONMENT RESEARCH UNIT OF THE ATHENS INSTITUTE FOR EDUCATION AND RESEARCH, 2008-05-23 |
| Heat dissipation from a heated square cylinder in an oscillating channel flow Ji, T.H.; Kim, S.Y.; Hyun, Jae Min, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006, ITherm, 2006-05-30 |
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