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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Impurity scattering in superconductors Kim, YJ; Chang, Kee-Joo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.31, pp.298 - 301, 1997-09 | |
| Low-dielectric-constant-film deposition with various gases in a helicon plasma reactor Yun, SM; Chang, Hong-Young; Oh, KS; Choi, CK, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.38, no.7B, pp.4531 - 4534, 1999-07 | |
| Formation and characterization of the fluorocarbonated-SiO2 films by O-2/FTES-helicon plasma chemical vapor deposition Oh, KS; Kang, MS; Lee, KM; Kim, DS; Choi, CK; Yun, SM; Chang, Hong-Young; Kim, KH, THIN SOLID FILMS, v.345, no.1, pp.45 - 49, 1999-05 | |
| Comparative study on the crack formations in the CeO2 buffer layers for YBCO films on textured Ni tapes and Pt tapes Oh, S.; Yoo, J.; Lee, K.; Kim, J.; Youm, Do-Jun, PHYSICA C, v.308, no.1-2, pp.91 - 98, 1998-11 | |
| Fabrication of YBCO coated conductors using biaxially textured Pt0.66Pd0.34 tapes as their substrates Yoo, J.; Youm, Do-Jun, PHYSICA C, v.319, no.3-4, pp.133 - 140, 1999-06 | |
| SiOF film deposition using FSi(OC2H5)(3) gas in a helicon plasma source Yun, SM; Chang, Hong-Young; Lee, KM; Kim, DC; Choi, CK, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.145, no.7, pp.2576 - 2580, 1998-07 | |
| Textures of CeO2 films grown on biaxially textured Pt0.7Pd0.3 substrates Kim, JH; Yoo, J; Youm, Do-Jun, THIN SOLID FILMS, v.349, no.1-2, pp.56 - 60, 1999-07 | |
| Low dielectric constant CF/SiOF composite film deposition in a helicon plasma reactor Yun, SM; Chang, Hong-Young; Kang, MS; Choi, CK, THIN SOLID FILMS, v.341, no.1-2, pp.109 - 111, 1999-03 | |
| Growth conditions of c-axis normal Y(1)Ba(2)Cu(3)O7-delta films on 20 degrees tilted crystalline substrates Kim, JH; Oh, S; Youm, Do-Jun, THIN SOLID FILMS, v.305, no.1-2, pp.304 - 308, 1997-08 | |
| EXPONENTIAL DECREASE OF THE XPS SIGNAL OF SUBSTRATE WITH THE INITIAL GROWTH OF Y1BA2CU3O7-DELTA OVERLAYER SEONG, D; LEE, S; Youm, Do-Jun, SOLID STATE COMMUNICATIONS, v.85, no.9, pp.811 - 813, 1993-03 |
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