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Microseale metal patterning using photosensitive silver organometallic compounds

Kim, JY; Son, HJ; Byun, YH; Lee, SY; Hwang, EC; Song, KY; Noh, CH; et al, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS REVIEW PAPERS, v.44, no.2, pp.865 - 868, 2005-02

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