Browse "AE-Journal Papers(저널논문)" by Subject bonding temperature
Showing results 1 to 2 of 2
| Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01 |
| Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08 |
Discover
Type
- 3,473 Article
- 1 Book chapter
Open Access
- 87 OA Article
Date issued
- 492 2020 - 2024
- 1,253 2010 - 2019
- 1,060 2000 - 2009
- 530 1990 - 1999
- 135 1980 - 1989