MS-Journal Papers(저널논문)
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1
Polarity control of siloxane composite films for triboelectric nanogenerator based self-powered body temperature monitoring
Kang, Seung-Mo; Shin, Jung Ho; Kim, Jeong Hyeon; Kang, Hyun Seok; Jung, Chang Kyu; Lee, Han Eol; Bae, Byeong-Soo, Nano Energy, v.127, 2024-08
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Artificial synaptic devices based on biomimetic electrochemistry: A review
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
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Zn anode with hydrophobic and ferroelectric P(VDF-TrFE) layers for dendrite-free aqueous Zn-ion batteries
Park, Hyeonghun; Seol, Woojun; Park, Geumyong; Anoop, Gopinathan; Kim, Juhun; Tamulevicius, Tomas; Tamulevicius, Sigitas; Joo, Soyun; HONG, DANIEL SEUNGBUM; Jo, Ji Young; Kim, Hyeong-Jin, APPLIED SURFACE SCIENCE, v.660, 2024-07
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Wafer-Scale Synthesis of Highly Oriented 2D Topological Semimetal PtTe2 via Tellurization
Choi, Minhyuk; Oh, Saeyoung; Hahn, Sungsoo; Ji, Yubin; Jo, Min-kyung; Kim, Jeongtae; Ju, Tae-Seong; Kim, Gyeongbo; Gyeon, MinSeung; Lee, Yuhwa; Do, Jeonghyeon; Choi, Seungwook; Kim, Ansoon; Yang, Seungmo; Hwang, Chanyong; Kim, Kab-Jin; Cho, Doohee; Kim, Changyoung; Kang, Kibum; Jeong, Hu Young; Song, Seungwoo, ACS Nano, v.18, no.23, pp.15154 - 15166, 2024-06
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Diffusion Control on the Van der Waals Surface of Monolayers for Uniform Bi-Layer MoS2 Growth
Kim Tae Soo; Noh Gichang; Kwon Seongdae; Kim Ji Yoon; Dhakal Krishna P.; Oh Saeyoung; Chai Hyun-Jun; Park Eunpyo; Kim In Soo; Lee Eunji; Kim Youngbum; Lee Jaehyun; Jo Min-kyung; Kang Minsoo; Park Cheolmin; Kim Jeongho; Park Jeongwon; Kim Suhyun; Kim Mingyu; Kim Yuseok; Choi Sung-Yool; Song Seungwoo; Jeong Hu Young; Kim Jeongyong; Kwak Joon Young; Kang Kibum, ADVANCED FUNCTIONAL MATERIALS, v.34, no.23, 2024-06
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Structural alignment of ZnO columns across multiple monolayer MoS2 layers as compliant substrates
Wang Xuejing; Kim Kyungtae; Derby Benjamin K.; McGuckin Terrence; Calderon Gabriel A.; Pettes Michael T.; Hwang Jinwoo; Kim Yeonhoo; Park Jeongwon; Chen Aiping; Kang Kibum; Yoo Jinkyoung, NANOSCALE, v.16, no.23, pp.11156 - 11162, 2024-06
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Fe-based high-entropy alloy with excellent mechanical properties enabled by nanosized precipitates and heterogeneous grain distribution
Jung, Heechan; Lee, Sangwon; Kang, Taehyeok; Zargaran, Alireza; Choi, Pyuck-Pa; Sohn, Seok Su, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.181, pp.71 - 81, 2024-05
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Cancer-targeting Gold-decorated Melanin Nanoparticles for In vivo Near-infrared Photothermal Therapy
Pornnoppadol, Gahsidit; Cho, Soojeong; Yu, Jeong Heon; Kim, Shin-Hyun; Nam, Yoon Sung, MOLECULAR SYSTEMS DESIGN & ENGINEERING, v.9, no.5, pp.507 - 517, 2024-05
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9
Compositionally Sequenced Interfacial Layers for High-Energy Li-Metal Batteries
Lee, Jeong-A; Cho, Yoonhan; Kim, Saehun; Kweon, Seong Hyeon; Kang, Haneul; Byun, Jeong Hwan; Kwon, Eunji; Seo, Samuel; Ryu, Kyoung Han; Kim, Wonkeun; Kwak, Sang Kyu; Choi, Nam-Soon; HONG, DANIEL SEUNGBUM, ADVANCED SCIENCE, v.11, no.17, 2024-05
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10
Composition and state prediction of lithium-ion cathode via convolutional neural network trained on scanning electron microscopy images
Oh, Jimin; Yeom, Jiwon; Madika, Benediktus; Kim, Kwang Man; Liow, Chi Hao; Agar, Joshua C; Hong, Seungbum, NPJ COMPUTATIONAL MATERIALS, v.10, no.1, 2024-05
Collection's Items (Sorted by Submit Date in Descending order): 7201 to 7220 of 7245
| Increment of dielectric properties of SrTiO3 thin films by SrO interlayer on Ru bottom electrodes Ahn, Ji-Hoon; Kim, Ja-Yong; Kang, Sang-Won, APPLIED PHYSICS LETTERS, v.91, no.6, 2007-08 |
| Effects of pd addition on au stud bumps/Al pads interfacial reactions and bond reliability Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.1210 - 1218, 2004-10 |
| Effect of electromigration on mechanical shear behavior of flip chip solder joints Nah, JW; Ren, F; Paik, Kyung-Wook; Tu, KN, JOURNAL OF MATERIALS RESEARCH, v.21, pp.698 - 702, 2006-03 |
| Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates Cho, SD; Jang, KW; Hyun, JG; Lee, S; Paik, Kyung-Wook; Kim, HS; Kim, Joungho, IEEE TRANCSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.28, no.4, pp.297 - 303, 2005-10 |
| Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications Jang, KW; Kwon, WS; Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.608 - 615, 2004-09 |
| Exothermic reaction induced eutectic Pb-Sn solder ball melting in the underfill curing process Kwon, WS; Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.172 - 176, 2004-03 |
| Formation of Pb/63Sn solder bumps using a solder droplet jetting method Son, HY; Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.28, no.3, pp.274 - 281, 2005-07 |
| CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03 |
| Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.24, no.4, pp.269 - 274, 2001-10 |
| Grain morphology of intermetallic compounds at solder joints Choi, WK; Jang, SY; Kim, JH; Paik, Kyung-Wook; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.3, pp.597 - 599, 2002-03 |
| Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.24, no.1, pp.24 - 32, 2001-03 |
| Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
| Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12 |
| The contact resistance and reliability of anisotropically conductive film (ACF) Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.2, pp.166 - 173, 1999-05 |
| Development of three-dimensional memory die stack packages using polymer insulated sidewall technique Ko, HS; Kim, JS; Yoon, HG; Jang, SY; Cho, SD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.252 - 256, 2000-05 |
| A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates Kim, JS; Paik, Kyung-Wook; Seo, HS, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.4, pp.638 - 641, 1999-11 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07 |
| A thermomechanical analysis of MCM-D substrate of polymer and metal multilayer Lim, JH; Kim, JS; Paik, Kyung-Wook; Earmme, Youn-Young, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.1123 - 1128, 2000 |
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