MS-Journal Papers(저널논문)
- Browse
- Issue Date Author Title Subject Type
Recent Items
-
1
Polarity control of siloxane composite films for triboelectric nanogenerator based self-powered body temperature monitoring
Kang, Seung-Mo; Shin, Jung Ho; Kim, Jeong Hyeon; Kang, Hyun Seok; Jung, Chang Kyu; Lee, Han Eol; Bae, Byeong-Soo, Nano Energy, v.127, 2024-08
-
2
Artificial synaptic devices based on biomimetic electrochemistry: A review
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
-
3
Zn anode with hydrophobic and ferroelectric P(VDF-TrFE) layers for dendrite-free aqueous Zn-ion batteries
Park, Hyeonghun; Seol, Woojun; Park, Geumyong; Anoop, Gopinathan; Kim, Juhun; Tamulevicius, Tomas; Tamulevicius, Sigitas; Joo, Soyun; HONG, DANIEL SEUNGBUM; Jo, Ji Young; Kim, Hyeong-Jin, APPLIED SURFACE SCIENCE, v.660, 2024-07
-
4
Wafer-Scale Synthesis of Highly Oriented 2D Topological Semimetal PtTe2 via Tellurization
Choi, Minhyuk; Oh, Saeyoung; Hahn, Sungsoo; Ji, Yubin; Jo, Min-kyung; Kim, Jeongtae; Ju, Tae-Seong; Kim, Gyeongbo; Gyeon, MinSeung; Lee, Yuhwa; Do, Jeonghyeon; Choi, Seungwook; Kim, Ansoon; Yang, Seungmo; Hwang, Chanyong; Kim, Kab-Jin; Cho, Doohee; Kim, Changyoung; Kang, Kibum; Jeong, Hu Young; Song, Seungwoo, ACS Nano, v.18, no.23, pp.15154 - 15166, 2024-06
-
5
Diffusion Control on the Van der Waals Surface of Monolayers for Uniform Bi-Layer MoS2 Growth
Kim Tae Soo; Noh Gichang; Kwon Seongdae; Kim Ji Yoon; Dhakal Krishna P.; Oh Saeyoung; Chai Hyun-Jun; Park Eunpyo; Kim In Soo; Lee Eunji; Kim Youngbum; Lee Jaehyun; Jo Min-kyung; Kang Minsoo; Park Cheolmin; Kim Jeongho; Park Jeongwon; Kim Suhyun; Kim Mingyu; Kim Yuseok; Choi Sung-Yool; Song Seungwoo; Jeong Hu Young; Kim Jeongyong; Kwak Joon Young; Kang Kibum, ADVANCED FUNCTIONAL MATERIALS, v.34, no.23, 2024-06
-
6
Structural alignment of ZnO columns across multiple monolayer MoS2 layers as compliant substrates
Wang Xuejing; Kim Kyungtae; Derby Benjamin K.; McGuckin Terrence; Calderon Gabriel A.; Pettes Michael T.; Hwang Jinwoo; Kim Yeonhoo; Park Jeongwon; Chen Aiping; Kang Kibum; Yoo Jinkyoung, NANOSCALE, v.16, no.23, pp.11156 - 11162, 2024-06
-
7
Fe-based high-entropy alloy with excellent mechanical properties enabled by nanosized precipitates and heterogeneous grain distribution
Jung, Heechan; Lee, Sangwon; Kang, Taehyeok; Zargaran, Alireza; Choi, Pyuck-Pa; Sohn, Seok Su, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.181, pp.71 - 81, 2024-05
-
8
Cancer-targeting Gold-decorated Melanin Nanoparticles for In vivo Near-infrared Photothermal Therapy
Pornnoppadol, Gahsidit; Cho, Soojeong; Yu, Jeong Heon; Kim, Shin-Hyun; Nam, Yoon Sung, MOLECULAR SYSTEMS DESIGN & ENGINEERING, v.9, no.5, pp.507 - 517, 2024-05
-
9
Compositionally Sequenced Interfacial Layers for High-Energy Li-Metal Batteries
Lee, Jeong-A; Cho, Yoonhan; Kim, Saehun; Kweon, Seong Hyeon; Kang, Haneul; Byun, Jeong Hwan; Kwon, Eunji; Seo, Samuel; Ryu, Kyoung Han; Kim, Wonkeun; Kwak, Sang Kyu; Choi, Nam-Soon; HONG, DANIEL SEUNGBUM, ADVANCED SCIENCE, v.11, no.17, 2024-05
-
10
Composition and state prediction of lithium-ion cathode via convolutional neural network trained on scanning electron microscopy images
Oh, Jimin; Yeom, Jiwon; Madika, Benediktus; Kim, Kwang Man; Liow, Chi Hao; Agar, Joshua C; Hong, Seungbum, NPJ COMPUTATIONAL MATERIALS, v.10, no.1, 2024-05
Collection's Items (Sorted by Submit Date in Descending order): 6941 to 6960 of 7245
| HIGH-TEMPERATURE DEFORMATION-BEHAVIOR OF 20 VOL-PERCENT SICW/2024AL METAL-MATRIX COMPOSITE KIM, HY; Hong, Soon-Hyung, SCRIPTA METALLURGICA ET MATERIALIA, v.30, no.3, pp.297 - 302, 1994-02 |
| Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates Hwang, JS; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.1722 - 1727, 2006-09 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02 |
| Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF) Park, J.-H.; Chung, C.-K.; Paik, Kyung-Wook; Lee, Soon-Bok, KEY ENGINEERING MATERIALS, v.326-328, no.0, pp.517 - 520, 2006 |
| Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability Kim, Hyoung-Joon; Chung, Chang-Kyu; Kwon, Yong-Min; Yim, Myung-Jin; Hong, Soon-Min; Jang, Se-Young; Moon, Young-Joon; et al, JOURNAL OF ELECTRONIC MATERIALS, v.36, pp.56 - 64, 2007-01 |
| Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.27, pp.77 - 84, 2007-01 |
| Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
| Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study Kwon, WS; Ham, SJ; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, no.2-4, pp.589 - 599, 2006 |
| Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection Yim, MJ; Kwon, W; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.126, pp.59 - 65, 2006-01 |
| Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly Hwang, JW; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1455 - 1461, 2005-11 |
| Comparison of theoretical predictions and experimental values of the dielectric constant of epoxy/BaTiO3 composite embedded capacitor films Cho, SD; Lee, SY; Hyun, JG; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.16, pp.77 - 84, 2005-02 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| A study on the temperature dependence of epoxy/BaTiO3 composite embedded capacitor films Hyun, JG; Cho, SD; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1264 - 1269, 2005-09 |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Kim, HJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1165 - 1171, 2005-08 |
| Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08 |
| Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01 |
| Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs Kwon, WS; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.93, no.6, pp.2634 - 2641, 2004-09 |
| Study on epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrate applications Cho, SD; Lee, JY; Hyun, JG; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.110, pp.233 - 239, 2004-07 |
| Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Yim, MJ; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.26, pp.304 - 313, 2006-08 |
Discover
Open Access
- 265 OA Article
Date issued
- 1,015 2020 - 2024
- 2,625 2010 - 2019
- 2,168 2000 - 2009
- 1,240 1990 - 1999
- 179 1980 - 1989