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INTERFACE STRENGTHS IN A ZRO2/AG-CU-AL-TI SYSTEM LEE, YM; Yu, Jin, CERAMICS INTERNATIONAL, v.21, no.6, pp.395 - 398, 1995-06 |
Calculation of intrinsic stress by creep deformation of an Si substrate on chemical vapor deposited diamond films Kim, JG; Yu, Jin; Cho, DH; Baik, YJ, DIAMOND AND RELATED MATERIALS, v.9, no.1, pp.61 - 66, 2000-01 |
Effects of heat treatment at 350 degrees C on the adhesion of Cu-Cr alloy films to polyimide Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE, v.35, no.8, pp.1949 - 1955, 2000-04 |
Cohesive failure of the Cu/polyimide system Park, IS; Ahn, EC; Yu, Jin; Lee, HY, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.282, no.1-2, pp.137 - 144, 2000-04 |
An elastic/plastic analysis of the intrinsic stresses in chemical vapor deposited diamond films on silicon substrates Yu, Jin; Kim, JG; Chung, JO; Cho, DH, JOURNAL OF APPLIED PHYSICS, v.88, no.3, pp.1688 - 1694, 2000-08 |
Adhesion strength of leadframe/EMC interfaces Lee, HY; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.12, pp.1444 - 1447, 1999-12 |
Effects of chemical oxidations on the fracture toughness of leadframe/EMC interfaces Lee, HY; Yu, Jin, METALS AND MATERIALS-KOREA, v.5, no.5, pp.471 - 476, 1999-10 |
Thin Films Adhesion in Cu/Cr/Polyimide and Cu/Cu-Cr/Polyimide Systems Joh, Cheol-Ho; Kim, Young-Ho; Oh, Tae Sung; Park, IkSung; Yu, Jin, 한국표면공학회지, v.29, no.5, pp.379 - 385, 1996-10 |
Effects of temperature/humidity treatments on the peel strength of CuCr alloy films on polyimide Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.3, pp.175 - 179, 1996-06 |
The link between crack velocity and rupture time in creeping solids Yu, Jin, ENGINEERING FRACTURE MECHANICS, v.53, no.2, pp.213 - 230, 1996 |
Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04 |
Alloy Design of Al-Al3(Ti,V,Zr) Composite Systems through Phase Stability Calculations Park, SI; Han, SJ; Kin, SJ; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.35, no.1, pp.112 - 120, 1997-01 |
Microstructures and Properties of the Mechanically Alloyed Intermetallic-Dispersion-Strengthened Al Alloys Han, SJ; Park, SI; Kin, JG; Kim, SJ; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.35, no.12, pp.1754 - 1762, 1997-12 |
Interfacial reaction of Sn-3.5wt%Ag solder alloy with a variance of Ni layer thickness Choi, YG; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.37, no.11, pp.1416 - 1421, 1999-11 |
고 코발트 - 니켈 이차 경화강에서의 M2C 석출물의 성장 거동에 관한 연구-PartⅠ. 시효처리의 영향 유충화; 서정룡; 이혁모; 김춘언, JOURNAL OF KOREAN INSTITUTE OF METALS AND MATERIALS, v.33, no.10, pp.1337 - 1343, 1995-10 |
일방향응고된 2상 TiAl 합금의 층상경계 방향제어 김민철; 오명훈; 이재현; 위당문, 대한금속·재료학회지, v.35, no.11, pp.1569 - 1575, 1997-11 |
Calculation of Microsegregation and Amount of Retained δ-ferrite in Fe-Cr-Ni Austenitic Stainless Steel Bae, JS; Seo, JL; Kim, SG; Lee, YD; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.36, no.3, pp.402 - 409, 1998-03 |
Effect of Lattice Matching of D022 and D023 on the Phase Transformation of the Dispersoid in Al-Al3(Ti,V,Zr) Alloy Han, SJ; Park, SI; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.36, no.5, pp.666 - 674, 1998-05 |
B, Hf, Zr첨가에 따른 LI/sub 2/Ni-20AI-10Fe 금속간화합물의 소성거동 김민철; 황승준; 오명훈; 위당문, 한국재료학회지, v.7, no.7, pp.592 - 596, 1997-01 |
L1(2) (Al,Cr)(3)Ti-based two-phase intermetallic compounds .2. Application to coating materials on TiAl Park J.Y.; Lee H.N.; Wee, Dang-Moon; Park S.W.; Oh M.H., SCRIPTA MATERIALIA, v.36, no.7, pp.801 - 806, 1997 |
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