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Study of shallow silicon trench etch process using planar inductively coupled plasmas Lee, JH; Yeom, GY; Lee, JW; Lee, JeongYong, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.15, no.3, pp.573 - 578, 1997-12 |
MEDIUM-TEMPERATURE PERFORMANCE OF CERMET ELECTRODE CONTAINING AG AND 3BI(2)O(3)CENTER-DOT-WO3 LEE, JY; Park, Chong-Ook; BAEK, HD; HWANG, JS, SENSORS AND ACTUATORS B-CHEMICAL, v.28, no.3, pp.211 - 215, 1995-09 |
GRAIN-BOUNDARY EFFECT IN (BI2O3)(0.75)(WO3)(0.25) AND (BI2O3)(0.7)(SRO)(0.3) SOLID ELECTROLYTES LEE, YJ; Park, Chong-Ook; BAEK, HD; HWANG, JS, SOLID STATE IONICS, v.76, no.1-2, pp.1 - 4, 1995-02 |
Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Rha, SY; Lee, SY; Kim, DW; Park, Chong-Ook, THIN SOLID FILMS, v.305, pp.254 - 258, 1997-01 |
Effects of the integrity of silicon thin films on the electrical characteristics of thin dielectric ONO film Kim, DW; Kim, KJ; Kim, DI; Lee, WJ; Lee, SY; Lee, YJ; Rha, SK; et al, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.8, no.2, pp.91 - 94, 1997-04 |
Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun, SS, JOURNAL OF MATERIALS RESEARCH, v.12, no.12, pp.3367 - 3372, 1997-12 |
Effect of oxygen ion energy and annealing in formation of tin oxide thin films Song, SK; Choi, WK; Cho, JS; Jung, HJ; Choi, D; Lee, JeongYong; Baik, HK; et al, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.4A, pp.2281 - 2287, 1997-04 |
Hall-Petch relation in two-phase TiAl alloys Jung, JY; Park, Joong Keun; Chun, CH; Her, SM, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.220, no.1-2, pp.185 - 190, 1996-12 |
Agglomeration of TiSi2 thin film on (100) Si substrates Rha, JJ; Park, Joong Keun, JOURNAL OF APPLIED PHYSICS, v.82, no.6, pp.2933 - 2937, 1997-12 |
Copper chemical vapour deposition using copper(I) hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Min, JS; Rha, SK; Chun , Soung Soon; Park, Chong-Ook; Kim, DW, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.2, pp.111 - 117, 1996-04 |
Field-aided thermal chemical vapor deposition of copper using Cu(I) organometallic precursor Lee, WJ; Rha, SK; Lee, SY; Park, Chong-Ook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.144, no.2, pp.683 - 686, 1997-02 |
Structural and chemical stability of Ta-Si-N thin film between Si and Cu Lee, YJ; Suh, BS; Rha, SK; Park, Chong-Ook, THIN SOLID FILMS, v.320, no.1, pp.141 - 146, 1998-05 |
NOx sensing properties of Ba2WO5 element at elevated temperature Kwak, MS; Hwang, JS; Park, Chong-Ook; Miura, N; Yamazoe, N, SENSORS AND ACTUATORS B-CHEMICAL, v.56, no.1-2, pp.59 - 64, 1999-06 |
Characterization of TiN barriers against Cu diffusion by capacitance-voltage measurement Rha, SK; Lee, SY; Lee, WJ; Hwang, YS; Park, Chong-Ook; Kim, DW; Lee, YS; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.16, no.4, pp.2019 - 2025, 1998-01 |
금속 배선 공정에서의 reflow 현상 이승윤; 박종욱, 한국재료학회지, v.9, no.5, pp.538 - 543, 1999-05 |
Sensitivity of Ba2WO5 to NOx gas at Elevated Temperature Kwak, Mi-Sun; Lee, Joo-Hyeon; Hwang, Jeong-Sug; Park, Chong-Ook, THE KOREAN JOURNAL OF CERAMICS, v.5, no.2, pp.110 - 114, 1999-06 |
Pd및 Pd-Rh 게이트 MOS센서의 수소및 황화수소가스에 대한 검지 특성 이창희; 박종욱, 한국수소및신에너지학회논문집, v.8, no.4, pp.145 - 154, 1997 |
열 필라멘트 CVD 법에 의해서 제작한 다이아몬드 막의 잔류응력제어 최시경; 정대영; 최한메, 한국세라믹학회지, v.32, no.7, pp.793 - 798, 1995-07 |
Barrier properties and failure mechanism of Ta-Si-N thin films for Cu interconnection Lee, YJ; Suh, BS; Kwon, MS; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.85, no.3, pp.1927 - 1934, 1999-02 |
Influence of Al content on cast microstructures of Ti-Al intermetallic compounds Jung, JY; Park, Joong Keun; Chun, CH, INTERMETALLICS, v.7, no.9, pp.1033 - 1041, 1999-09 |
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