MS-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 4461 to 4480 of 7245

4461
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09

4462
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P

Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01

4463
Cu/Sn 비아를 적용한 일괄적층 방법에 의한 다층연성기판의 제조

이혁재; 유진, 마이크로전자 및 패키징학회지, v.11, no.4, pp.1 - 5, 2004-12

4464
미세조직이 Sn계 무연솔더의 크리프 특성에 미치는 영향

유진; 이규오; 주대권, 마이크로전자 및 패키징학회지, v.10, no.3, pp.29 - 35, 2003-09

4465
Analysis of the T-peel strength in a Cu/Cr/polyimide system

Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09

4466
Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi

Yu, Jin; Joo, DK; Shin, SW, ACTA MATERIALIA, v.50, no.17, pp.4315 - 4324, 2002-10

4467
Residual stress measurements in electroless plated Ni-P films

Song, JY; Yu, Jin, THIN SOLID FILMS, v.415, no.1-2, pp.167 - 172, 2002-08

4468
Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films

Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04

4469
전기화학적 환원 분석을 통한 Sn의 산화에 대한 연구

조성일; 유진; 강성권; Da-Yuan Shin, 마이크로전자 및 패키징학회지, v.11, no.3, pp.55 - 62, 2004-09

4470
Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07

4471
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08

4472
무전해 Ni(P)과 무연솔더와의 반응 중 금속간화합물의 spalling 현상에 관한 연구

손윤철; 유진; 강성권; D.Y.Shin; 이택영, 마이크로전자 및 패키징학회지, v.11, no.3, pp.37 - 45, 2004-09

4473
액상 Au-Sn 솔더와 Ni 기판의 계면현상에 대한 고찰

김종훈; 정상원; 이혁모; 김성수, Journal of the Microelectronics and Packaging Society, v.11, no.3, pp.47 - 53, 2004-09

4474
Spectroscopic ellipsometry studies on the optical constants of indium tin oxide films deposited under various sputtering conditions

Jung, Yeon Sik, THIN SOLID FILMS, v.467, no.1-2, pp.36 - 42, 2004-11

4475
고 규소강에서 규칙상 소멸조건에 관한 연구

유지형; 신제식; 배준수; 이진형; 이택동; 이혁모, 대한금속·재료학회지, v.39, no.4, pp.394 - 398, 2001-04

4476
Ferroelectric thin-film-based electrically tunable bandpass filters

Kim, Il-Doo; Lim, MH; Kim, Ho Gi; Kim, KB; Yun, TS, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.5, no.11, pp.25 - 28, 2002-11

4477
Stress effect on the tuning properties of Ba0.5Sr0.5TiO3 thin films

Kim, Il-Doo; Park, JH; Kim, Ho Gi, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.5, no.7, pp.18 - 21, 2002-07

4478
Stable sol-gel microstructured and microfluidic networks for protein patterning

Kim, YD; Park, Chan Beum; Clark, DS, BIOTECHNOLOGY AND BIOENGINEERING, v.73, no.5, pp.331 - 337, 2001-06

4479
L-Pyroglutamate spontaneously formed from L-glutamate inhibits growth of the hyperthermophilic archaeon Sulfolobus solfataricus

Park, Chan Beum; Lee, SB; Ryu, DDY, APPLIED AND ENVIRONMENTAL MICROBIOLOGY, v.67, no.8, pp.3650 - 3654, 2001-08

4480
Sol-gel encapsulated enzyme arrays for high-throughput screening of biocatalytic activity

Park, Chan Beum; Clark, DS, BIOTECHNOLOGY AND BIOENGINEERING, v.78, no.2, pp.229 - 235, 2002-04

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