MS-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 3981 to 4000 of 7245

3981
Hardness and fracture toughness of ultra-rine WG-10Co-X cemented carbides prepared from nanocrystalline powders

Cha, Seung I.; Hong, Soon Hyung, ZEITSCHRIFT FUR METALLKUNDE, v.96, pp.172 - 176, 2005-02

3982
Photoluminescence of Ga-doped ZnO film grown on c-Al2O3 (0001) by plasma-assisted molecular beam epitaxy

Park, HC; Byun, D; Angadi, B; Park, DH; Choi, WK; Choi, JW; Jung, Yeon Sik, JOURNAL OF APPLIED PHYSICS, v.102, no.7, pp.J155 - J157, 2007-10

3983
Tin Pest 방지 솔더합금의 크리프 특성

김성범; 유진; 손윤철, 마이크로전자 및 패키징학회지, v.12, no.1, pp.47 - 52, 2005-03

3984
Study on the effects of copper oxide growth on the peel strength of copper/polyimide

Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08

3985
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03

3986
전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구

김종연; 유진, 마이크로전자 및 패키징학회지, v.15, no.1, pp.33 - 37, 2008-03

3987
Luminescence of bound excitons in epitaxial ZnO thin films grown by plasma-assisted molecular beam epitaxy

Jung, Yeon Sik; Choi, WK; Kononenko, OV; Panin, GN, JOURNAL OF APPLIED PHYSICS, v.99, no.1, pp.365 - 370, 2006-01

3988
Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations

Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12

3989
Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08

3990
The oxidation of lead-free Sn alloys by electrochemical reduction analysis

Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOM, v.57, no.6, pp.50 - 52, 2005-06

3991
Comparative study of thermally conductive fillers in underfill for the electronic components

Lee, WS; Yu, Jin, DIAMOND AND RELATED MATERIALS, v.14, no.10, pp.1647 - 1653, 2005-10

3992
Oxidation study of pure tin and its alloys via electrochemical reduction analysis

Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.5, pp.635 - 642, 2005-05

3993
전기화학적 환원분석을 통한 무연 솔더합금의 산화에 대한 연구

조성일; 유진; 강성권; Shih, Da-Yuan, 마이크로전자 및 패키징학회지, v.12, no.1, pp.35 - 40, 2005-03

3994
Molecular dynamic simulation of coalescence between silver and palladium clusters

Kim, Hyun-You; Lee, Sung-Hoon; Kim, Hyoung-Gyu; Ryu, Ji-Hoon; Lee, Hyuck-Mo, MATERIALS TRANSACTIONS, v.48, no.3, pp.455 - 459, 2007-03

3995
Exchange-bias of NiFe/NiO bilayer

Noh, ES; Lee, Hyuck-Mo, PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, v.475-479, pp.2231 - 2234, 2005

3996
무연 복합 솔더의 미소경도에 미치는 기계적 변형과 온도의 영향

이주원; 강성권; 이혁모, Journal of the Microelectronics and Packaging Society, v.12, no.2, pp.121 - 128, 2005-06

3997
A3569합급의 α-Al(Fe,Mn)Si 정출상에 미치는 Mn의 영향

김현유; 한상원; 이혁모, 대한금속·재료학회지, v.43, no.6, pp.413 - 417, 2005-06

3998
A theoretical study of an amorphous aluminium oxide layer used as a tunnel barrier in a magnetic tunnel junction

Noh, E. S.; Ulloa, S. E.; Lee, HyuckMo, PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, v.244, no.12, pp.4427 - 4430, 2007-12

3999
A theoretical study of the effect of electronic structures of ferromagnets on giant magnetoresistance

Noh, ES; Lee, HyuckMo; Ulloa, SE, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.48, no.3, pp.451 - 459, 2006-03

4000
Pressure affects transcription profiles of Methanocaldococcus jannaschii despite the absence of barophilic growth under gas-transfer limitation

Boonyaratanakornkit, Boonchai; Cordova, Jesus; Park, Chan Beum; Clark, Douglas S., ENVIRONMENTAL MICROBIOLOGY, v.8, no.11, pp.2031 - 2035, 2006-11

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