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Results 41-50 of 2168 (Search time: 0.009 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Structural and optical characteristics of InGaN/GaN multiple quantum wells with different growth interruption Cho, HK; Lee, JeongYong; Sharma, N; Humphreys, J; Yang, GM; Kim, CS, PHYSICA STATUS SOLIDI B-BASIC RESEARCH, v.228, no.1, pp.165 - 168, 2001-11 | |
| Cyclic oxidation behavior and recrystallization of cold-rolled Ni3Al foils Kim, SH; Oh, MH; Kishida, K; Hirano, T; Wee, Dang-Moon, MATERIALS LETTERS, v.58, no.22-23, pp.2867 - 2871, 2004-09 | |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 | |
| Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07 | |
| Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04 | |
| 무전해 Ni(P)과 무연솔더와의 반응 중 금속간화합물의 spalling 현상에 관한 연구 손윤철; 유진; 강성권; D.Y.Shin; 이택영, 마이크로전자 및 패키징학회지, v.11, no.3, pp.37 - 45, 2004-09 | |
| 전기화학적 환원 분석을 통한 Sn의 산화에 대한 연구 조성일; 유진; 강성권; Da-Yuan Shin, 마이크로전자 및 패키징학회지, v.11, no.3, pp.55 - 62, 2004-09 | |
| Creep rupture of lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin; Shin, SW, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.6, pp.541 - 547, 2003-06 | |
| High transmittance attenuated phase shifting mask of chromium aluminum oxynitride Choi, E; Kim, E; Kim, H; Kim, Y; Tian, H; No, Kwangsoo, PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING , v.4562 II, no.0, pp.1141 - 1150, 2001 | |
| Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05 |
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