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Results 1-10 of 278 (Search time: 0.011 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Highly Tunable Self-Assembled Nanostructures from a Poly(2-vinylpyridine-b-dimethylsiloxane) Block Copolymer Jeong, Jae-Won; Park, Woon-Ik; Kim, Mi-Jeong; Ross, C. A.; Jung, Yeon-Sik, NANO LETTERS, v.11, no.10, pp.4095 - 4101, 2011-10 | |
| Electrical characterization of dense and porous nanocrystalline Gd-doped ceria electrolytes Jo, Seung Hwan; Muralidharan, P.; Kim, Do Kyung, SOLID STATE IONICS, v.178, no.39-40, pp.1990 - 1997, 2008-03 | |
| Temperature-dependent Raman scattering studies of polycrystalline BiFeO3 bulk ceramics Rout, Dibyaranjan; Moon, Kyoung-Seok; Kang, Suk-Joong L, JOURNAL OF RAMAN SPECTROSCOPY, v.40, no.6, pp.618 - 626, 2009-06 | |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 | |
| Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04 | |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 | |
| Structural properties and interfacial layer formation of Pd films grown on InP substrates Kim, TW; Yoon, YS; Lee, JeongYong; Shin, YD; Yoo, KH; Kim, CO, APPLIED SURFACE SCIENCE, v.136, no.1-2, pp.117 - 122, 1998-10 | |
| CHANGE OF THE CRITICAL THICKNESS IN THE PREFERRED ORIENTATION OF TIN FILMS OH, UC; JE, JH; Lee, JeongYong, JOURNAL OF MATERIALS RESEARCH, v.10, no.3, pp.634 - 639, 1995-03 | |
| The Role of NiO Doping in Reducing the Impact of Humidity on the Performance of SnO2-Based Gas Sensors: Synthesis Strategies, and Phenomenological and Spectroscopic Studies Kim, Hae-Ryong; Haensch, Alexander; Kim, Il-Doo; Barsan, Nicolae; Weimar, Udo; Lee, Jong-Heun, ADVANCED FUNCTIONAL MATERIALS, v.21, no.23, pp.4456 - 4463, 2011-12 | |
| Directed Self-Assembly with Sub-100 Degrees Celsius Processing Temperature, Sub-10 Nanometer Resolution, and Sub-1 Minute Assembly Time Park, Woon-Ik; Kim, Kyung-Ho; Jang, Hyun-Ik; Jeong, Jae-Won; Kim, Jong-Min; Choi, Jae-Suk; Park, Jae-Hong; Jung, Yeon-Sik, SMALL, v.8, no.24, pp.3762 - 3768, 2012-12 |
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