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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Plasma-assisted molecular-beam epitaxy of ZnO films on (0001) Al2O3: Effects of the MgO buffer layer thickness Kim, Jae Goo; Han, Seok Kyu; Kang, Dong-Suk; Yang, Sang Mo; Hong, Soon-Ku; Lee, Jae Wook; Lee, Jeong Yong; Song, Jung-Hoon; Yao, Takafumi, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.53, no.1, pp.271 - 275, 2008-07 | |
| Characterization of microstructure and defects in epitaxial ZnO (1 1 (2)over-bar 0) films on Al(2)O(3) (1 (1)over-bar 0 2) substrates by transmission electron microscopy Lee, Jae Wook; Han, Seok Kyu; Hong, Soon-Ku; Lee, JeongYong; Yao, Takafumi, JOURNAL OF CRYSTAL GROWTH, v.310, no.18, pp.4102 - 4109, 2008-08 | |
| Transformation mechanisms from metallic Zn nanocrystals to insulating ZnSiO(3) nanocrystals in a SiO(2) matrix due to thermal treatment Yuk, Jong Min; Lee, Jeong-Yong; No, Y. S.; Kim, T. W.; Choi, W. K., APPLIED PHYSICS LETTERS, v.93, no.22, 2008-12 | |
| Phase control of iridium and iridium oxide thin films in atomic layer deposition Kim, Sung-Wook; Kwon, Se-Hun; Kwak, Dong-Kee; Kang, Sang-Won, JOURNAL OF APPLIED PHYSICS, v.103, no.2, 2008-01 | |
| Improvement of morphological stability of PEALD-iridium thin films by adopting two-step annealing process Kim, Sung-Wook; Kwon, Se-Hun; Jeong, Seong-Jun; Park, Jin-Seong; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.11, no.11, pp.H303 - H305, 2008-09 | |
| Thermally nitrided Cu-5.3Cr alloy for application as metallic separators in PEMFCs Lee, Hye-Youn; Lee, Seok-Hyun; Kim, Jeong-Heon; Kim, Min-Chul; Wee, Dang-Moon, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.33, no.15, pp.4171 - 4177, 2008-08 | |
| Atomic layer deposition of silicon oxide thin films by alternating exposures to Si(2)Cl(6) and O(3) Lee, Seung-Won; Park, Kwangchol; Han, Byeol; Son, Sang-Ho; Rha, Sa-Kyun; Park, Chong-Ook; Lee, Won-Jun, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.11, no.7, pp.23 - 26, 2008 | |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 | |
| Effects of Si on the repassivation kinetics and SCC susceptibility of stainless steels Toor, Ihsan-ul-Haq; Kwon, JaeYoung; Kwon, Hyuk-Sang, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.9, pp.495 - 500, 2008-07 | |
| Development of new buffer layers for Cu(In,Ga)Se-2 solar cells Ahn, Byung Tae; Larina, L; Kim, KH; Ahn, SJ, PURE AND APPLIED CHEMISTRY, v.80, no.10, pp.2091 - 2102, 2008-10 |
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