DSpace at KOASAS
Browsing DSpace

Browse "MS-Journal Papers(저널논문)" by Subject underfill

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 1 of 1

1
Exothermic reaction induced eutectic Pb-Sn solder ball melting in the underfill curing process

Kwon, WS; Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.172 - 176, 2004-03

Discover

Type

Open Access

Date issued

. next

Subject

. next

rss_1.0 rss_2.0 atom_1.0