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A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Zhang, Shuye; Kim, Seung-Ho; Kim, Tae-Wan; Kim, Yoo Sun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.9 - 14, 2015-01

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