Browse "MS-Journal Papers(저널논문)" by Subject thermal deformation
Showing results 1 to 3 of 3
| Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007 |
| Low-Temperature Curable Photo-Active Anisotropic Conductive Films (PA-ACFs) Kim, Il; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.9, pp.3236 - 3242, 2014-05 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
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