Browse "MS-Journal Papers(저널논문)" by Subject system-in-package
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| Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die Yu, Seon-Young; Kwon, Yong-Min; Kim, Jin-Su; Jeong, Tae-Sung; Choi, Seog-Moon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.4, pp.625 - 633, 2012-04 |
| Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05 |
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