Browse "MS-Journal Papers(저널논문)" by Subject soldering
Showing results 1 to 3 of 3
| Effects of Plating Conditions on the Microstructure of 80Sn-20Pb Electrodeposits from an Organic Sulfonate Bath Kwon, Hyuk-Sang, SURFACE AND COATINGS TECHNOLOGY, v.78, no.1-3, pp.56 - 63, 1996-01 |
| Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03 |
| Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
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