Browse "MS-Journal Papers(저널논문)" by Subject solder interface
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| Abnormal grain growth of Ni3Sn4 at Sn-33Ag/Ni interface Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.45, no.3, pp.710 - 713, 2004-03 |
| Formation of intermetallic compounds in the Ni bearing lead free composite solders Lee, JW; Lee, ZH; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2344 - 2350, 2005-11 |
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