Browse "MS-Journal Papers(저널논문)" by Subject reflow
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| A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates Son, Ho-Young; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1832 - 1842, 2008-12 |
| Characterization of small-sized eutectic Sn-Bi solder bumps fabricated using electroplating Jung, HR; Kim, HH; Lee, Won-Jong, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.5, pp.1067 - 1073, 2006-05 |
| Oxidation, grain growth and reflow characteristics of copper thin films prepared by chemical vapor deposition Lee, SY; Choi, SH; Park, Chong-Ook, THIN SOLID FILMS, v.359, no.2, pp.261 - 267, 2000-01 |
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