Browse "MS-Journal Papers(저널논문)" by Subject nonconductive paste (NCP)
Showing results 1 to 2 of 2
| Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications Jang, KW; Kwon, WS; Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.608 - 615, 2004-09 |
| Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling Jang, Kyung-Woon; Kim, Hyoung-Joon; Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.3, pp.559 - 565, 2008-09 |
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