Browse "MS-Journal Papers(저널논문)" by Subject nonconduclive adhesives
Showing results 1 to 1 of 1
| Highly reliable non-conductive adhesives for flip chip CSP applications Yim, MJ; Hwang, JS; Kwon, W; Jang, KW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.26, pp.150 - 155, 2003-04 |
Discover
Open Access
- 265 OA Article
Date issued
- 1,016 2020 - 2024
- 2,625 2010 - 2019
- 2,168 2000 - 2009
- 1,240 1990 - 1999
- 179 1980 - 1989