Browse "MS-Journal Papers(저널논문)" by Subject low pressure bonding

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Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding

Kim, KH; Hong, Soon-Hyung; Cha, SI; Lim, SC; Kwon, HC; Yoon, WK, MATERIALS TRANSACTIONS, v.51, pp.787 - 792, 2010-04

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