Browse "MS-Journal Papers(저널논문)" by Subject lamination
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| A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates Kim, JS; Paik, Kyung-Wook; Seo, HS, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.4, pp.638 - 641, 1999-11 |
| A thermomechanical analysis of MCM-D substrate of polymer and metal multilayer Lim, JH; Kim, JS; Paik, Kyung-Wook; Earmme, Youn-Young, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.1123 - 1128, 2000 |
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