Browse "MS-Journal Papers(저널논문)" by Subject intermetallic compounds (IMC)

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(UBM)Under bump metallurgy study for Pb-free bumping

Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05

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