Browse "MS-Journal Papers(저널논문)" by Subject intermetallic compounds
Showing results 1 to 9 of 9
| Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.24, no.4, pp.269 - 274, 2001-10 |
| Cyclic oxidation behavior and recrystallization of cold-rolled Ni3Al foils Kim, SH; Oh, MH; Kishida, K; Hirano, T; Wee, Dang-Moon, MATERIALS LETTERS, v.58, no.22-23, pp.2867 - 2871, 2004-09 |
| Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11 |
| Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
| Growth kinetics of Cu-Snintermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints Suh, Min-Suk; Park, Chan-Jin; Kwon, Hyuk-Sang, MATERIALS CHEMISTRY AND PHYSICS, v.110, no.1, pp.95 - 99, 2008-07 |
IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints Ren, Ning; Fang, Heng; Wang, Dong; Hou, Chenyi; Zhao, Yatao; Chen, Fan; Tian, Ye; et al, MATERIALS, v.13, no.1, 2020-01 |
| Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal Sohn, WH; Bong, HH; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.355, pp.231 - 240, 2003-08 |
| Tracking the Mn Diffusion in the Carbon-Supported Nanoparticles Through the Collaborative Analysis of Atom Probe and Evaporation Simulation Jung, Chanwon; Jun, Hosun; Jang, Kyuseon; Kim, Se-Ho; Choi, Pyuck-Pa, MICROSCOPY AND MICROANALYSIS, v.28, no.6, pp.1841 - 1850, 2022-12 |
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