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Showing results 1 to 7 of 7

1
Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations

Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12

2
Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate

Choi, WK; Yoon, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.42, no.5, pp.783 - 789, 2001

3
Effect of under bump metallurgy and reflows on shear strength and microstructure of joint between Cu substrate and Sn-36Pb-2Ag solder alloy

Yoon, SW; Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.44, no.2, pp.290 - 297, 2003-02

4
Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging

Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11

5
Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate

Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06

6
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09

7
The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12

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