Browse "MS-Journal Papers(저널논문)" by Subject ball shear tests
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| Effects of Cu/AI intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, JY; Paik, Kyung-Wook; KOh, KW; Won, J; Choe, S; Lee, J; et al, IEEE TRANSACTIONS ON COMPONENETS PACKAGING AND MANUFACTURING TECHNOLOGY, v.26, no.2, pp.367 - 374, 2003-06 |
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