Browse "MS-Journal Papers(저널논문)" by Subject UNDER-BUMP-METALLIZATION

Showing results 1 to 1 of 1

1
Effect of electromigration on mechanical shear behavior of flip chip solder joints

Nah, JW; Ren, F; Paik, Kyung-Wook; Tu, KN, JOURNAL OF MATERIALS RESEARCH, v.21, pp.698 - 702, 2006-03

Discover

Type

Open Access

Date issued

. next

Subject

. next

rss_1.0 rss_2.0 atom_1.0