DSpace at KOASAS
Browsing DSpace

Browse "MS-Journal Papers(저널논문)" by Subject UBM (under bump metallurgy)

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 1 of 1

1
Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems

Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.24, no.4, pp.269 - 274, 2001-10

Discover

Type

Open Access

Date issued

. next

Subject

. next

rss_1.0 rss_2.0 atom_1.0