Browse "MS-Journal Papers(저널논문)" by Subject Soldering
Showing results 1 to 3 of 3
| Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11 |
| Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10 |
| Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.7, pp.889 - 895, 2011-04 |
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