Showing results 1 to 3 of 3
An angular distribution function for the sputter-depositing atoms and general equations describing the initial thickness profile of a thin film deposited inside a via and trench by sputtering Kim, Chang-Gyu; Lee, Won-Jong, THIN SOLID FILMS, v.519, no.1, pp.74 - 80, 2010-10 |
Quantitative study on the enhancement of sidewall coverage of sputter-deposited film by partially tapering the sidewall of via holes Kim, Chang-Gyu; Lee, Won-Jong, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.29, no.2, pp.020604-1 - 020604-6, 2011-03 |
Three-dimensional deposition topography simulation based on new combinations of flux distribution and surface representation algorithms Kwon, Ui-Hui; Lee, Won-Jong, THIN SOLID FILMS, v.445, no.1, pp.80 - 89, 2003-11 |
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