Browse "MS-Journal Papers(저널논문)" by Subject STACKING
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| Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03 |
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