Browse "MS-Journal Papers(저널논문)" by Subject SOLDERS
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| Effects of reactive diffusion on stress evolution in Cu-Sn films Song, JY; Yu, Jin; Lee, TY, SCRIPTA MATERIALIA, v.51, no.2, pp.167 - 170, 2004-07 |
| Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM) Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07 |
| Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study Jang, SY; Wolf, J; Ehrmann, O; Reichl, H; Paik, Kyung-Wook, MICROSYSTEM TECHNOLOGIES, v.7, no.5-6, pp.269 - 272, 2002-01 |
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