Browse "MS-Journal Papers(저널논문)" by Subject SOLDERING REACTION
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| Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow Cho, Moon-Gi; Park, Yong-Sung; Seo, Sun-Kyoung; Paik, Kyung-Wook; Lee, Hyuck-Mo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1939 - 1946, 2011-12 |
| (UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
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