Browse "MS-Journal Papers(저널논문)" by Subject SOLDER JOINTS
Showing results 1 to 4 of 4
| A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process Kim, K. H.; Yu, Jin; Kim, J. H., SCRIPTA MATERIALIA, v.63, no.5, pp.508 - 511, 2010-09 |
| A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates Son, Ho-Young; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1832 - 1842, 2008-12 |
| Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10 |
| Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01 |
Discover
Open Access
- 265 OA Article
Date issued
- 1,015 2020 - 2024
- 2,625 2010 - 2019
- 2,168 2000 - 2009
- 1,240 1990 - 1999
- 179 1980 - 1989