Browse "MS-Journal Papers(저널논문)" by Subject PB-FREE SOLDER
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| Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate Choi, WK; Yoon, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.42, no.5, pp.783 - 789, 2001 |
| Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate Choi, WK; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.11, pp.1251 - 1255, 1999 |
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