Browse "MS-Journal Papers(저널논문)" by Subject PB-FREE
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| Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development Lee, Jung-Sub; Chu, Kun-Mo; Patzelt, Rainer; Manessis, Dionysios; Ostmann, Andreas; Jeon, DukYoung, MICROELECTRONIC ENGINEERING, v.85, no.7, pp.1577 - 1583, 2008-07 |
| Enhancement of heterogeneous nucleation of beta-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures Cho, Moon Gi; Kim, Hyun You; Seo, Sun-Kyoung; Lee, HyuckMo, APPLIED PHYSICS LETTERS, v.95, no.2, pp.021905-1 - 021905-3, 2009-07 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
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