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Advanced Cu/Polymer Hybrid Bonding System for Fine-Pitch 3D Stacking Devices Park, Juseong; Kang, Sukkyung; Kim, Myeong Eun; Kim, Nam Jun; Kim, Jungkyun; Kim, Sanha; Kim, Kyung Min, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.20, 2023-10 |
Highly Condensed Epoxy-Oligosiloxane-Based Hybrid Material for Transparent Low-k Dielectric Coatings Yang, Seung-Cheol; Kwak, Seung-Yeon; Jin, Jung-Ho; Bae, Byeong-Soo, ACS APPLIED MATERIALS & INTERFACES, v.1, no.7, pp.1585 - 1590, 2009-07 |
Photocurable transparent cycloaliphatic epoxy hybrid materials crosslinked by oxetane Yang, Seung-Cheol; Jin, Jung-Ho; Kwak, Seung-Yeon; Bae, Byeong-Soo, JOURNAL OF APPLIED POLYMER SCIENCE, v.126, pp.E380 - E386, 2012-11 |
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