Browse "MS-Journal Papers(저널논문)" by Subject Intermetallic compound

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Thermodynamic Prediction of Interface Reaction Phases at Cu/Solder Joints

Lee, HyuckMo; Yoon, Seung Wook; Lee, Byeong-Joo, JOURNAL OF ELECTRONIC MATERIALS, v.27, no.11, pp.1161 - 1166, 1998

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