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Showing results 1 to 4 of 4

1
Dry etching characteristics of Pb(ZrTi)O-3 films in CF4 and Cl-2/CF4 inductively coupled plasmas

Jung, JK; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.40, no.3A, pp.1408 - 1419, 2001-03

2
Effect of Gas Composition on TiN Thin-Film Fabrication in N2/H2/Ar/TiCl4 Inductively Coupled Plasma-Enhanced Chemical Vapor Deposition System

Jang, SS; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.40, no.8, pp.4819 - 4824, 2001-08

3
Enhancement of adhesion strength of electroless-plated Ni under bump metallurgy by introduction of inductively coupled plasma enhanced bias sputtering Ni seed layer

Kim, ED; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS EXPRESS LETTERS, v.44, no.50-52, pp.1541 - 1543, 2005-12

4
Etch-induced damage in single crystal Si trench etching by planar inductively coupled Cl-2/N-2 and Cl-2/HBr plasmas

Lee, JeongYong; Hwang, SW; Yeom, GY; Lee, JW; Lee, JY, THIN SOLID FILMS, v.341, no.1-2, pp.168 - 171, 1999-03

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