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Analytical study on the 3D-printed structure and mechanical properties of basalt fiber-reinforced PLA composites using X-ray microscopy Yu, Siwon; Hwang, Yun Hyeong; Hwang, Jun Yeon; Hong, Soon Hyung, COMPOSITES SCIENCE AND TECHNOLOGY, v.175, pp.18 - 27, 2019-05 |
Effect of starting powder on damage resistance of silicon nitrides Lee, SK; Lee, KS; Lawn, BR; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.81, no.8, pp.2061 - 2070, 1998-08 |
Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects Morris Jr. J.W.; Kim C.U.; Lee, HyuckMo, JOURNAL OF APPLIED PHYSICS, v.82, no.4, pp.1592 - 1598, 1997 |
Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
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