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Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package

Zhang, Shuye; Duan, Ran; Xu, Sunwu; Xue, Panfei; Wang, Chengqian; Chen, Jieshi; Paik, Kyung-Wook; et al, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06

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