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Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02 |
The contact resistance and reliability of anisotropically conductive film (ACF) Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.2, pp.166 - 173, 1999-05 |
무전해및전해 도금법으로 제작된 ACF 접합용니켈 범프 특성에 관한 연구 이원종; 진경선, 마이크로전자 및 패키징학회지, v.14, no.3, pp.21 - 27, 2007-09 |
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