Browse "MS-Journal Papers(저널논문)" by Subject 3D stacking
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| Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films Choi, Yong-Won; Shin, Ji Won; Suk, Kyung-lim; Kim, Youngsoon; Kim, Il; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4214 - 4223, 2014-11 |
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