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Browse "MS-Journal Papers(저널논문)" by Author Yu, Seon-Young

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1	Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die Yu, Seon-Young; Kwon, Yong-Min; Kim, Jin-Su; Jeong, Tae-Sung; Choi, Seog-Moon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.4, pp.625 - 633, 2012-04

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