Showing results 1 to 8 of 8
A thermodynamic study of phase equilibria in the Sn-Bi-Pb solder system Yoon, SW; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.167 - 178, 1998 |
Calculation of surface tension and wetting properties of Sn-based solder alloys Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.297 - 302, 1999-01 |
Dependence of particle volume fraction on sound velocity and attenuation of EPDM composites Kim, KS; Lee, KI; Kim, HY; Yoon, SW; Hong, Soon-Hyung, ULTRASONICS, v.46, pp.177 - 183, 2007-05 |
Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate Choi, WK; Yoon, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.42, no.5, pp.783 - 789, 2001 |
Effect of under bump metallurgy and reflows on shear strength and microstructure of joint between Cu substrate and Sn-36Pb-2Ag solder alloy Yoon, SW; Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.44, no.2, pp.290 - 297, 2003-02 |
Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332, 1999 |
Investigation of the phase equilibria in the Sn-Bi-In alloy system Yoon, SW; Rho, BS; Lee, HyuckMo; Kim, CU; Lee, BJ, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.30, no.6, pp.1503 - 1515, 1999-06 |
Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn-Bi-In-Zn system Yoon, SW; Soh, JR; Lee, HyuckMo; Lee, BJ, ACTA MATERIALIA, v.45, no.3, pp.951 - 960, 1997 |
Discover